Biography: Prof. WEI received Master degree in Engineering from the Department of Radio and Electronics, Tsinghua University, Beijing, China in 1984. He received Doctor degree in Applied Science in 1991 from the Laboratory of Electronics, Faculté Polytechnique de Mons, Belgium and then became the assistant professor in the same laboratory. From 1989 to1991, he also worked as a research fellow in ARAMIS, Belgium. Dr. WEI returned to China in 1995. From 1998 to 2005, he worked for Datang Telecom Technology Co., Ltd. successively as Vice-President, President & CEO. He was the founder, President & CEO and Chairman of the Board of Datang Microelectronics Technology Co., Ltd. from 1996 to 2005. He was the CTO of Datang Telecom Industry Group from 2005 to 2006. 

Dr. WEI is now the Dean of the Department of Micro- and Nano-Electronics, Director of the Institute of Microelectronics, Director of the Research Center for Mobile Computing, Tsinghua University and professor of Peking University. Dr. WEI is the Vice President of CSIA, President of VLSI Design Branch, CSIA and the President of Communication Specific IC Committee, CIC. He is the fellow of CIE.

Biography: Prof. Hao Min received his PhD degree from Fudan University in 1991. During 1995-1998, he was a visiting associate professor in Stanford University focusing on CMOS image sensors technologies. Meanwhile he was the consultant at a number of IC design companies in Silicon Valley. From 1998 to 2005, he served as director of the State Key Laboratory of ASIC & System, Fudan University. He is currently vice dean of School of Microelectronics, research director of the AUTO-ID Lab of Fudan University. He was General Manager of Shanghai Huahong Integrated Circuits Co., Ltd. during 1998-2006 where his team developed the first contact-less smart card chip which was successfully applied to the Shanghai Public Transportation System and designed the chip for the second generation ID cards of China. He is co-founder of Shanghai Quanray Electronics. He has contributed over 80 papers and over 20 patents authorized or pending.

Biography: Prof. dr. LIU Zewen received his BS degree in Physics from the University of Science and Technology (USTC), Hefei, China in 1983 and received his Ph.D degree in Microfabrication from the University of Paris-sud (Paris XI), Paris, France in 1997. He is currently full professor in Institute of Microelectronics at Tsinghua University (IMETU). His research interests are MEMS and Micro/nano system technologies, including materials, process and devices of RF-MEMS, NEMS, and integrated sensors.

He was the pioneer in X-ray lithography for IC application and RF MEMS technology for communication application. He was awarded the Chinese National Award for his contribution in the works on lithography, and the Tsinghua University Excellent Teacher Award for his contribution in MEMS research. He is the American IEEE member, Chinese CIE and CSMNT member.

He has published more than 150 technical papers in the academic journal and conference. He is an inventor of more than 20 patents.

Biography: Prof. Rhee received the B.S. degree in electronics engineering from Seoul National University, Seoul, Korea, in 1991, the M.S. degree in electrical engineering from the University of California, Los Angeles, in 1993, and the Ph.D. degree in electrical and computer engineering from the University of Illinois, Urbana-Champaign, in 2001. From 1997 to 2001, he was with Conexant Systems, Newport Beach, CA, where he was a Principal Engineer and developed low-power, low-cost fractional-N synthesizers. From 2001 to 2006, he was with IBM Thomas J. Watson Research Center, Yorktown Heights, NY and worked on clocking area for high-speed I/O serial links, including low-jitter phase-locked loops, clock-and-data recovery circuits, and on-chip testability circuits. In August 2006, he joined the faculty as an Associate Professor at the Institute of Microelectronics, Tsinghua University, Beijing, China. His current research interests include short-range low-power radios for next generation wireless systems and clock/frequency generation circuits for wireline and wireless communications. He holds 23 U.S. patents. 

Dr. Rhee is currently an IEEE Distinguished Lecturer of the Solid-State Circuits Society (2016-2017) and serves as an Associate Editor for IEEE JSSC. He has been an Associate Editor for IEEE TCAS-II (2008-2009) and a Guest Editor for IEEE JSSC Special Issue in November 2012 and November 2013. He has served as a member of several IEEE conferences, including ISSCC (2012-2016), CICC, and A-SSCC.

Biography: Dr. Zhuoxiang Ren is a professor at the University Pierre and Marie Curie (UPMC) in France and a Thousand Talent Program researcher at Institute of Microelectronics (IME) of Chinese Academy of Sciences (CAS). He graduated from Huazhong University of Science and Technology in 1982 and received his PhD from the Insititut Polytechnique de Toulouse in France in 1985. After his PhD, he was, respectively, an assistant professor at the Ecole Normale Superieure de Cahcan and a senior researcher at the Centre Nationale de Recherche Scientifique in France. During this period, he conducted his research at the Laboratory de Génie Electrique de Paris. From 1999 to 2010, he worked at various EDA companies, including Ansoft Corporation, Cadence Design Systems Inc., Mentor Graphics Corporation as a staff engineer and a principal engineer, respectively. He is currently head of research team on micro and nano electronics at the laboratory of electronics and electromagnetism in University of Paris VI and leads a research team on electromagnetic design and modeling in IME-CAS. 

Prof. Ren has many years of research experiences on numerical modeling of electromagnetic systems and development of EDA tools. He has published over 200 journals and refereed international conferences papers. He has been awarded a Bronze Medal of CNRS in France in 1996. His research interests include numerical methods for the computation of electromagnetic fields, modeling and simulation of multi-scale and multi-physics problems in micro and nano electronic and electromechanical devices and systems.

Biography: Fujiang Lin received the BSEE and MSEE degrees from USTC, Hefei, China, and the Dr.-Ing. degree in MMIC from the University of Kassel, Germany. Dr. Lin has been the “Chinese K-Talent Plan” full time professor at USTC since 2010. He established the USTC Micro/nano-Elecronic System Integration R&D Center (MESIC) focusing on advanced nanotech devices modeling and IC design. 

Prior returning back USTC, Dr. Lin worked as SMTS and PI in the Institute of Microelectronics, A*STAR, Singapore; as adjuct Associte Professor at NUS; as Director in CHRT (now GlobalFoundries), as Technical Director at HP/Agilent (now Keysight) EEsof; as founder and CEO of Transilica Singapore.

Professor Lin has extensive hand-on and multi-discipline experiences and knowledge in advanced micro-/nano-electronics technologies, as well as the related integrated circuits and system design. 

Biography: Dr. Dake Liu is the chair professor for Computer engineering of Linköping University, Sweden. He is the state expert of China, professor assigned by China recruitment of global expert (1000 plan). He is currently the director of ASIP (Application Specific Instruction-set Processor) Lab, Beijing Institute of Technology. He spun off Coresonic Sweden acquired by MTK and FreehandDSP Sweden acquired by VIA. His research interests are ASIP, communication systems, and medical micro systems. He published more than 200 journal and international conference papers, single paper SCI citation is more than 300 and one paper achieved global download score.

Biography: Shanhong Xia received her B.Sc. degree from the Electronic Engineering Department, Tsinghua University, Beijing, China in 1983, her M.Sc. degree from the Institute of Electronics, Chinese Academy of Sciences (IECAS) in 1986, and her Ph.D. degree in Electrical Engineering from Cambridge University, UK, in 1994.  She joined the IECAS in 1986 and worked there till 1990 when she received a Royal Fellowship from the Royal Society and went to the Engineering Department of Cambridge University, UK. She worked in Cambridge following her Ph.D., and returned to the IECAS in 1995.  She received a Berkeley Scholarship (2002-2004) from the University of California at Berkeley, and worked as a visiting scholar at the Berkeley Sensor and Actuator Center (BSAC) for several short periods. She is now a professor at IECAS, as well as a fellow and council member of the Chinese Institute of Electronics, vice-president of the Sensor Society and council member of the China Instrument and Control Society, a member of the Standing Committee of China Micro-Nano Technology Society. She served as the General Chair and the International Steering Committee Chair at the 16th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers’2011). She is a member of editorial board of several journals such as the IEEE Sensors Journal, Microsystems and Nanoengineering, and etc.  Her research interests include sensors and microsystems, system-on-chip, wireless sensor network, micro/nano fabrications, and so on. Her current research work mainly focuses on electric field microsensors, and integrated microsensor systems for water quality monitoring.

Biography: Prof. Wang received the B.S. and M.S. degree from Tsinghua University, Beijing, China, in 2007 and 2010, respectively. He received the Ph.D. degree in electrical engineering from University of California, Irvine in 2014. From 2012 to 2013, he also worked for Broadcom Corp. on the phased-array based 60GHz WiGig chip set. From 2014 to 2017, he was with Qualcomm Inc. on the RF Front-End research for cellular application.

He is currently the Director of THz Integrated Circuits and Systems Lab in the Center for Integrated Circuits, UESTC. He is bestowed as the recipient of The Recruitment Program for Young Professionals (National 1000Plan Talent) in 2017. His research field includes the design of novel RF, MMW and THz silicon-based integrated circuits for next generation 10-gigabit wireless communications as well as imaging systems.

Biography: Dr. Qiwei Ren received the bachelor and master degrees from Tsinghua Univ. and Ph. D. from Delft Univ. of Technology, all in Microelectronics. In 2001, he joined in Advanced Memory Design Center in Philips Semiconductors. In 2006, he joined the design center of Qimonda Technology in Xi’an, served as the Director of DRAM product development. In 2009, he re-found Xi’an Sinochip Semiconductors Co. Ltd. as General Manager, also as the Senior Vice President in Shandong Sinochip Semiconductors. In later 2015, he joined Unigroup Guoxin Electronics Co., Ltd. as Vice President and the general manger of Xi’an UniIC Semiconductors Co. Ltd. In the last nearly 20 years, he mainly works in the field of solid state memory, from research to volume production, work interest covers memory device, design and testing. He also lead several national research projects as the Project Leader or as the Chief Expert in DRAM, FLASH, SRAM and RRAM research and development projects.  He is Distinguished Expert in National "Thousand Talents Plan", and part time professor in Xi’an Jiaotong University.

Biography: Dr. Haijun Zhao joined SMIC in October of 2010, has 25 years of experience in semiconductor operations and technology development. Ph.D. in wireless from the University of TsingHua, and MBA from University of Chicago. A states "thousand person plan" distinguished expert and the National Integrated Circuit promotion committee members.

Biography: Prior of Ali, Sean serves as chief scientist for sensing solution lab, and lead the innovation for next generation of internet of things and smart phone in Huawei corporate RD team. Prior Huawei, Sean worked in sensing and control industry 15 years in silicon valley, including STMicro, Bosch sensortec, both are world top 3 sensor companies in the world. Sean also worked for Intel as principal engineer on artificial intelligence, activity recognition, and context awareness. He possesses in depth knowledge in sensing system, including physical design of MEMS and sensor, circuitry, algorithm optimization, system implementation.